1. Crystallography and Product Fundamentals of Silicon Carbide
1.1 Polymorphism and Atomic Bonding in SiC
(Silicon Carbide Ceramic Plates)
Silicon carbide (SiC) is a covalent ceramic substance composed of silicon and carbon atoms in a 1:1 stoichiometric ratio, identified by its exceptional polymorphism– over 250 recognized polytypes– all sharing solid directional covalent bonds yet differing in piling sequences of Si-C bilayers.
One of the most technically appropriate polytypes are 3C-SiC (cubic zinc blende framework), and the hexagonal types 4H-SiC and 6H-SiC, each displaying subtle variants in bandgap, electron flexibility, and thermal conductivity that affect their viability for certain applications.
The toughness of the Si– C bond, with a bond power of approximately 318 kJ/mol, underpins SiC’s extraordinary firmness (Mohs solidity of 9– 9.5), high melting factor (~ 2700 ° C), and resistance to chemical deterioration and thermal shock.
In ceramic plates, the polytype is typically picked based on the intended usage: 6H-SiC is common in architectural applications due to its ease of synthesis, while 4H-SiC dominates in high-power electronics for its premium fee service provider flexibility.
The vast bandgap (2.9– 3.3 eV depending on polytype) likewise makes SiC a superb electric insulator in its pure kind, though it can be doped to function as a semiconductor in specialized electronic gadgets.
1.2 Microstructure and Stage Purity in Ceramic Plates
The performance of silicon carbide ceramic plates is seriously dependent on microstructural attributes such as grain dimension, density, phase homogeneity, and the visibility of secondary phases or impurities.
Premium plates are commonly fabricated from submicron or nanoscale SiC powders through advanced sintering methods, causing fine-grained, completely thick microstructures that optimize mechanical strength and thermal conductivity.
Impurities such as cost-free carbon, silica (SiO TWO), or sintering aids like boron or aluminum need to be meticulously managed, as they can form intergranular films that lower high-temperature stamina and oxidation resistance.
Recurring porosity, even at low degrees (
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